Description
- Cooler Master’s new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.
- 13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.
- Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.
- Provides seamless and secure contact between surfaces.
- Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.
- Easily cut to the perfect size for your application. Multiple choices of thickness are available.
